For the mechanical industry, the substances they often contact are a series of parts and components. No matter which style or type, they will be more or less familiar with it. The workers in the relevant industries know what kind of parts are used in which structure or application location. However, no matter which configuration is used, it can only be implemented in specific mechanical equipment after certain processing steps. Therefore, professionals call this process precision parts processing.
There are many ways to process precision parts, such as heat treatment. Parts, which refer to indivisible single parts in machinery, are the basic elements of the machine and the basic units in the mechanical manufacturing process. The manufacturing process generally does not require an assembly process. Such as bearing sleeve, bearing bush, nut, crankshaft, blade, gear, cam, connecting rod body, connecting rod head, etc.
1、 Machining of precision parts. It mainly includes precision turning, mirror grinding and grinding. Micro turning is carried out on a precision lathe with a fine grinding single crystal diamond turning tool. The cutting thickness is only about 1 μ m. It is often used to process high-precision, highly smooth and clean parts such as spherical, aspherical and planar mirrors of non-ferrous materials.
2、 Precision parts processing. When the machining accuracy of precision parts is aimed at nanometers, or even atomic units (atomic lattice distance is 0.1~0.2 nanometers), the machining method of ultra precision parts is not suitable. It is necessary to use the method of special precision parts machining, that is, chemical energy, electrochemical energy, thermal energy or electrical energy, to make these energies exceed the joint energy between atoms, so as to remove the adhesion, union or lattice deformation between some atoms on the surface of the workpiece, In order to achieve the goal of ultra precision machining.
These processes include mechanochemical polishing, ion sputtering and ion implantation, electron beam exposure, laser beam processing, metal evaporation and molecular beam epitaxy.
